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材料工程  2014, Vol. 0 Issue (12): 60-65    DOI: 10.11868/j.issn.1001-4381.2014.12.011
  材料与工艺 本期目录 | 过刊浏览 | 高级检索 |
Ti/Nb/Cu作缓冲层的TiC金属陶瓷/304不锈钢扩散连接
李佳, 盛光敏
重庆大学 材料科学与工程学院, 重庆 400044
Diffusion Bonding of TiC Cermet/304SS with Ti/Nb/Cu Relief Interlayers
LI Jia, SHENG Guang-min
College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China
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摘要 采用Ti/Nb/Cu复合中间层在连接温度为925℃、保温时间20min、焊接压力8MPa的条件下对TiC金属陶瓷和304不锈钢进行真空扩散连接.通过光学金相显微镜(OM)、扫描电镜(SEM)、能谱(EDS)及X射线衍射(XRD)分析观察接头微观组织、断口形貌、反应界面元素分布、断面的物相组成.结果表明:在TiC金属陶瓷和304不锈钢之间形成一个明显的转变过渡区,界面反应产物主要为[Ti,Nb]固溶体+Ti+NbTi4,Nb和剩余Cu+[Cu,Fe]固溶体+Cr.接头抗剪强度达到84.6MPa,断裂发生在TiC和Ti之间的位于TiC上的扩散反应层上.Nb对接头残余应力的改善起到关键作用,界面强度高于因残余应力作用而弱化了的陶瓷基体强度.
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李佳
盛光敏
关键词 扩散连接TiC金属陶瓷Ti/Nb/Cu复合中间层组织断裂    
Abstract:The vacuum diffusion bonding of TiC cermet and 304 stainless steel (304SS) was conducted with Ti/Nb/Cu multi-interlayer at 925℃ for 20min with a pressure of 8MPa. The microstructures,fracture morphology elemental distribution of reaction interface and phase composition of fracture surface were investigated with optical microscopy(OM),scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The results show that an obvious transition zone is formed between TiC cermet and 304SS, and the interface products are[Ti,Nb] solid solution+Ti+NbTi4,Nb, remnant Cu+[Cu,Fe] solid solution+Cr. The shear strength of joints is up to 84.6MPa. The failure mostly occurs in diffusion reaction layer between TiC and Ti within TiC cermet.Nb interlayer plays a major role in the relief of the residual stress, and the interface strength is higher than that of TiC cermet weakened due to the effect of residual stress.
Key wordsdiffusion bonding    TiC cermet    Ti/Nb/Cu multi-interlayer    microstructure    fracture
收稿日期: 2013-10-09      出版日期: 2014-12-20
1:  TG457  
基金资助:国家自然科学基金资助项目(50675234)
通讯作者: 盛光敏(1958—),博士,教授,博士生导师,主要从事异种材料的连接和高抗震性能建筑结构钢的研究,联系地址:重庆市沙坪坝区沙正街174号重庆大学材料科学与工程学院(400044)     E-mail: gmsheng@cqu.edu.cn
引用本文:   
李佳, 盛光敏. Ti/Nb/Cu作缓冲层的TiC金属陶瓷/304不锈钢扩散连接[J]. 材料工程, 2014, 0(12): 60-65.
LI Jia, SHENG Guang-min. Diffusion Bonding of TiC Cermet/304SS with Ti/Nb/Cu Relief Interlayers. Journal of Materials Engineering, 2014, 0(12): 60-65.
链接本文:  
http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2014.12.011      或      http://jme.biam.ac.cn/CN/Y2014/V0/I12/60
[1] 苗赫濯,林旭平,齐龙浩.先进结构陶瓷材料研究进展[J].稀有金属材料与工程,2008,37(1):14-19.MIAO He-zhuo, LIN Xu-ping, QI Long-hao. The progress of research on advanced structure ceramics[J]. Rare Metal Materials and Engineering,2008,37(1):14-19.
[2] 孙康宁,尹衍升,李爱民.金属间化合物/陶瓷基复合材料[M].北京:机械工业出版社,2002.SUN Kang-ning, YIN Yan-sheng, LI Ai-min. Intermetallic/Ceramic Matrix Composites[M].Beijing:China Machine Press, 2002.
[3] KIM S W, MIN K H, KANG S H. Rim structure in Ti(C0.7-N0.3)-WC-Ni cermets[J]. Journal of the American Ceramic Society,2003,86(10):1761-1766.
[4] BOLOGNINI S, FEUSIER G, MARI D. TiMoCN-based cermets: high-temperature deformation[J]. International Journal of Refractory Metal and Hard Materials,2003,21(l-2):19-29.
[5] PARK S H, KANG S H. Toughened ultra-fine (Ti,W)(CN)-Ni cermets[J]. Scripta Materialia,2005,52(2):129-133.
[6] 关德慧,于宝海,孙超,等.一种碳化钛金属陶瓷烧结同时与结构钢焊接工艺[P]. 中国专利:CN1361084A,2002.GUAN De-hui, YU Bao-hai, SUN Chao. The sintering technology of a kind of titanium carbide ceramic at the same time welding with structural steel[P]. China Patent:CN1361084A,2002.
[7] ZHANG C G, QIAO G J,JIN Z H. Active brazing of pure alumina to Kovar alloy based on the partial transient liquid phase (PTLP) technique with Ni-Ti interlayer[J]. Journal of the European Ceramic Society,2002,22(13):2181-2186.
[8] 叶大萌,熊惟皓.Ti(C,N)基金属陶瓷与45钢的真空钎焊[J].稀有金属材料与工程,2008,37(7):1281-1284.YE Da-meng, XIONG Wei-hao. Vacuum brazing of Ti(C,N) based cermets to 45 steel[J].Rare Metal Materials and Engineering,2008,37(7):1281-1284.
[9] ZHANG L X, FENG J C, ZHANG B Y. Ag-Cu-Ti alloy for brazing TiC cermet/steel[J]. Materials Letters,2005,59(1):110-113.
[10] HATTALI M L, MESRATI N, TREHEUX D. Electric charge trapping, residual stresses and properties of ceramics after metal/ceramics bonding[J]. Journal of the European Ceramic Society,2012,32(4):717-725.
[11] CAO J, SONG X G, LI C, et al. Brazing ZrO2 ceramic to Ti-6Al-4V alloy using NiCrSiB amorphous filler foil: interfacial microstructure and joint properties[J]. Materials Characterization, 2013,81(7):85-91.
[12] KIM J J, PARK J W, EAGER T W. Interfacial microstructure of partial transient liquid phase bonded Si3N4-to-Inconel 718 joints[J]. Materials Science and Engineering:A,2003,344(1-2):240-244.
[13] CHEN Z, CAO M S,ZHAO Q Z. Interracial microstructure and strength of partial transient liquid-phase bending of silicon nitride with Ti/Ni multi-interlayer [J].Materials Science and Engineering:A,2004,380(1-2):394-401.
[14] 邹贵生,吴爱萍,任家烈,等.Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷结合机理[J].清华大学学报:自然科学版,2001,41(4-5):51-54. ZOU Gui-sheng, WU Ai-ping, REN Jia-lie, et al. TLP diffusion bonding mechanism of Si3N4 ceramics with multiple Ti/Ni/Ti interlayers[J]. Journal of Tsinghua University: Science and Technology,2001,41(4-5):51-54.
[15] 曲文卿,庄鸿寿,张彦华.异种材料TLP扩散连接过程的非对称性[J].中国有色金属学报,2003,13(2):300-304. QU Wen-qing, ZHUANG Hong-shou, ZHANG Yan-hua. Dissymmetry of TLP diffusion bonding of dissimilar materials[J]. The Chinese Journal of Nonferrous Metals,2003,13(2):300-304.
[16] DILERMANDO T, MAURIZIO F, GERT D O. Diffusion bonding of aluminum oxide to stainless steel using stress relief interlayers[J]. Materials Science and Engineering,2002,337(1-2):287-296.
[17] 毛样武,周建军,李树杰.采用Ti/Ag/Ti中间层连接 SiC 陶瓷的有限元应力分析[J].北京航空航天大学学报,2004,30(10):930-933. MAO Yang-wu, ZHOU Jian-jun, LI Shu-jie. Analysis of the residual thermal stresses of SiC joint with Ti/Ag/Ti interlayer by FEM[J].Journal of Beijing University of Aeronautics and Astronautics,2004,30(10):930-933.
[18] SHEN X Q, LI Y J, PUTCHKOV U A, et al. Finite-element analysis of residual stresses in Al2O3-TiC/W18Cr4V diffusion bonded joints[J]. Computational Materials Science,2009,45(2):407-410.
[19] MARKS R A, SUGAR J D, GLAESER A M. Ceramic joining IV: effects of processing conditions on the properties of alumina joined via Cu/Nb/Cu interlayers[J]. Journal of Materials Science,2001,36(23):5609-5624.
[20] HUANG W Q, LI Y J, WANG J, et al. Microstructure and fracture of TiC-Al2O3/W18Cr4V diffusion bonded joint[J]. Kovove Materialy-Metallic Materials,2010,48(4):227-231.
[21] MIN Y, ZOU Z D, SONG S L, et al. Effect of interlayer thickness on strength and fracture of Si3N4 and Inconel 600 joint[J]. Key Engineering Materials,2005,297-300:2435-2440.
[22] 戴永年.二元合金相图集[M].北京:科学出版社,2009. DAI Yong-nian. Binary Alloy Phase Diagrams[M]. Beijing:Science Press,2009.
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