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材料工程  2016, Vol. 44 Issue (8): 11-16    DOI: 10.11868/j.issn.1001-4381.2016.08.002
  材料与工艺 本期目录 | 过刊浏览 | 高级检索 |
界面改性对SiCp/Cu复合材料热物理性能的影响
刘猛, 白书欣, 李顺, 赵恂, 熊德赣
国防科学技术大学 材料科学与工程系, 长沙 410073
Effect of Interfacial Modifying on Thermo-physical Properties of SiCp/Cu Composites
LIU Meng, BAI Shu-xin, LI Shun, ZHAO Xun, XIONG De-gan
Department of Materials Science and Engineering, National University of Defense Technology, Changsha 410073, China
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摘要 采用热压烧结法成功制备SiCp/Cu复合材料。采用溶胶-凝胶工艺在SiC颗粒表面制备Mo涂层,研究Mo界面阻挡层对复合材料热物理性能的影响。结果表明:过氧钼酸溶胶-凝胶体系能够在SiC颗粒表面包覆连续性、均匀性较好的MoO3涂层,最佳工艺配比为SiC:MoO3=5:1(质量比)、过氧化氢:乙醇=1:1(体积比),SiC表面丙酮和氢氟酸预清洗处理有利于MoO3涂层的沉积生长。MoO3在540℃第一步氢气还原后转变为MoO2,MoO2在940℃第二步氢气还原后完全转变为Mo,Mo涂层包覆致密完整。热压烧结SiCp/Cu复合材料微观组织致密均匀,且相比原始SiC颗粒增强的SiCp/Cu,经溶胶-凝胶法界面改性处理的SiCp/Cu复合材料热导率明显提高,SiC体积分数约为50%时,SiCp/Cu复合材料热导率达到214.16W·m-1·K-1
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刘猛
白书欣
李顺
赵恂
熊德赣
关键词 溶胶-凝胶表面改性Mo涂层SiCp/Cu热压烧结热导率    
Abstract:SiCp/Cu composites were successfully fabricated by vacuum hot-pressing method. Molybdenum coating was deposited on the surface of silicon carbide by sol-gel method. The effects of the interfacial design on thermo-physical properties of SiCp/Cu composites were studied. The results indicate that:continuous and uniform MoO3 coating can be deposited on the surface of silicon carbide by peroxomolybdic acid sol-gel system, and the best processing parameters are as follows:SiC:MoO3=5:1(mass ratio), H2O2:C2H5OH=1:1(volume ratio), and surface pretreatment with acetone and hydrofluoric acid is good to the deposition and growth of MoO3 coating. After hydrogen reduction at 540℃ for 90min the MoO3 is changed into MoO2, and then hydrogen reduction at 940℃ for 90min the MoO2 is changed into Mo absolutely, and the Mo coating is continuous and uniform. SiCp/Cu composites prepared by vacuum hot-pressing method show a compact and uniform microstructure, and the thermal conductivity of the composites is increased obviously after the Mo coating interfacial modification, which can reach 214.16W·m-1·K-1 when the volume of silicon carbide is about 50%.
Key wordssol-gel    surface modification    Mo coating    SiCp/Cu    hot-pressing sintering    thermal conductivity
收稿日期: 2015-04-20      出版日期: 2016-08-23
中图分类号:  TB333  
通讯作者: 白书欣(1964-),男,教授,研究方向:电子封装材料,磁性材料等,联系地址:湖南省长沙市开福区国防科学技术大学一院五系(410073),joge.jk@126.com     E-mail: joge.jk@126.com
引用本文:   
刘猛, 白书欣, 李顺, 赵恂, 熊德赣. 界面改性对SiCp/Cu复合材料热物理性能的影响[J]. 材料工程, 2016, 44(8): 11-16.
LIU Meng, BAI Shu-xin, LI Shun, ZHAO Xun, XIONG De-gan. Effect of Interfacial Modifying on Thermo-physical Properties of SiCp/Cu Composites. Journal of Materials Engineering, 2016, 44(8): 11-16.
链接本文:  
http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2016.08.002      或      http://jme.biam.ac.cn/CN/Y2016/V44/I8/11
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