Abstract：SiCp/Cu composites were successfully fabricated by vacuum hot-pressing method. Molybdenum coating was deposited on the surface of silicon carbide by sol-gel method. The effects of the interfacial design on thermo-physical properties of SiCp/Cu composites were studied. The results indicate that:continuous and uniform MoO3 coating can be deposited on the surface of silicon carbide by peroxomolybdic acid sol-gel system, and the best processing parameters are as follows:SiC:MoO3=5:1(mass ratio), H2O2:C2H5OH=1:1(volume ratio), and surface pretreatment with acetone and hydrofluoric acid is good to the deposition and growth of MoO3 coating. After hydrogen reduction at 540℃ for 90min the MoO3 is changed into MoO2, and then hydrogen reduction at 940℃ for 90min the MoO2 is changed into Mo absolutely, and the Mo coating is continuous and uniform. SiCp/Cu composites prepared by vacuum hot-pressing method show a compact and uniform microstructure, and the thermal conductivity of the composites is increased obviously after the Mo coating interfacial modification, which can reach 214.16W·m-1·K-1 when the volume of silicon carbide is about 50%.
SCHUBERT T,BRENDEL A,SCHMID K,et al.Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications[J].Composites Part A:Applied Science and Manufacturing,2007,38(12):2398-2403.
WANG C C,MIN G H,KANG S B.Thermal conducting property of SiCp-reinforced copper matrix composites by hot pressing[J].Compos Mater,2011,45(18):1849-1852.
ORDONEX S,GARVAJIAL L,MARTINEZ V,et al.Fracture toughness of SiC-Cu based alloys cermets[J].Materials Science Forum,2005,498-499:350-356.
SUNBERG G,PSUL P,SUNG C,et al.Fabrication of CuSiC metal matrix composites[J].Journal of Materials Science,2006,41(2):485-504.
WANG Z M,WYNBLATT P.Study of a reaction at the solid Cu/α-SiC interface[J].Journal of Materials Science,1998,33(5):1177-1181.
SCHUBERT T,TRINDADE B.Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications[J].Mater Sci Eng:A,2008,475(122):39-44.
章林,曲选辉,何新波,等.高体积分数SiC/Cu复合材料的研究进展[J].粉末冶金技术,2008,26(3):224-229. ZHANG L,QU X H,HE X B,et al.Study on the SiC/Cu composites with high volume friction[J].Powder Metallurgy Technology,2008,26(3):224-229.
MARTINEZ V,ORDONEZ S,CASTRO F,et al.Wetting of silicon carbide by copper alloys[J].Journal of Materials Science,2003,38(19):4047-4054.
禹胜林,薛松柏,尹邦跃,等.Al-Si电子封装材料粉末冶金法致密性研究[J].材料工程,2014,(2):45-50. YU S L,XUE S B,YIN B Y,et al.Sintering densification of Al-Si composite by powder metallurgy method for electronic packaging[J].Journal of Materials Engineering,2014,(2):45-50.
SUNBERG G.Identification and characterization of diffusion barriers for Cu/SiC systems[J].Journal of Materials Science,2005,40(13):3383-3393.
ZHAN Y Z,ZHANG G D.The effect of interfacial modifying on the mechanical and wear properties of SiCp/Cu composites[J].Materials Letters,2003,57(29):4583-4591.
王大伟,王美丽,李中翔,等.溶胶-凝胶法制备BiFeO3粉体及其表征[J].材料工程,2014,(12):50-54. WANG D W,WANG M L,LI Z X,et al.Preparation and characterization of BiFeO3 powders by sol-gel method[J].Journal of Materials Engineering,2014,(12):50-54.
HASSELMAN D P H,JOHNSON L F.Effective thermal conductivity of composites with interfacial thermal barrier resistance[J].Compos Mater,1987,21:508-515.
刘猛,白书欣,李顺,等.界面设计对Sip/Al复合材料组织和性能的影响[J].材料工程,2014,(8):61-66. LIU M,BAI S X,LI S,et al.Effects of interface design on microstructure and properties of Sip/Al composites[J].Journal of Materials Engineering,2014,(8):61-66.