Please wait a minute...
 
材料工程  2016, Vol. 44 Issue (8): 11-16    DOI: 10.11868/j.issn.1001-4381.2016.08.002
  材料与工艺 本期目录 | 过刊浏览 | 高级检索 |
界面改性对SiCp/Cu复合材料热物理性能的影响
刘猛, 白书欣, 李顺, 赵恂, 熊德赣
国防科学技术大学 材料科学与工程系, 长沙 410073
Effect of Interfacial Modifying on Thermo-physical Properties of SiCp/Cu Composites
LIU Meng, BAI Shu-xin, LI Shun, ZHAO Xun, XIONG De-gan
Department of Materials Science and Engineering, National University of Defense Technology, Changsha 410073, China
全文: PDF(4260 KB)   HTML()
输出: BibTeX | EndNote (RIS)      
摘要 采用热压烧结法成功制备SiCp/Cu复合材料。采用溶胶-凝胶工艺在SiC颗粒表面制备Mo涂层,研究Mo界面阻挡层对复合材料热物理性能的影响。结果表明:过氧钼酸溶胶-凝胶体系能够在SiC颗粒表面包覆连续性、均匀性较好的MoO3涂层,最佳工艺配比为SiC:MoO3=5:1(质量比)、过氧化氢:乙醇=1:1(体积比),SiC表面丙酮和氢氟酸预清洗处理有利于MoO3涂层的沉积生长。MoO3在540℃第一步氢气还原后转变为MoO2,MoO2在940℃第二步氢气还原后完全转变为Mo,Mo涂层包覆致密完整。热压烧结SiCp/Cu复合材料微观组织致密均匀,且相比原始SiC颗粒增强的SiCp/Cu,经溶胶-凝胶法界面改性处理的SiCp/Cu复合材料热导率明显提高,SiC体积分数约为50%时,SiCp/Cu复合材料热导率达到214.16W·m-1·K-1
服务
把本文推荐给朋友
加入引用管理器
E-mail Alert
RSS
作者相关文章
刘猛
白书欣
李顺
赵恂
熊德赣
关键词 溶胶-凝胶表面改性Mo涂层SiCp/Cu热压烧结热导率    
Abstract:SiCp/Cu composites were successfully fabricated by vacuum hot-pressing method. Molybdenum coating was deposited on the surface of silicon carbide by sol-gel method. The effects of the interfacial design on thermo-physical properties of SiCp/Cu composites were studied. The results indicate that:continuous and uniform MoO3 coating can be deposited on the surface of silicon carbide by peroxomolybdic acid sol-gel system, and the best processing parameters are as follows:SiC:MoO3=5:1(mass ratio), H2O2:C2H5OH=1:1(volume ratio), and surface pretreatment with acetone and hydrofluoric acid is good to the deposition and growth of MoO3 coating. After hydrogen reduction at 540℃ for 90min the MoO3 is changed into MoO2, and then hydrogen reduction at 940℃ for 90min the MoO2 is changed into Mo absolutely, and the Mo coating is continuous and uniform. SiCp/Cu composites prepared by vacuum hot-pressing method show a compact and uniform microstructure, and the thermal conductivity of the composites is increased obviously after the Mo coating interfacial modification, which can reach 214.16W·m-1·K-1 when the volume of silicon carbide is about 50%.
Key wordssol-gel    surface modification    Mo coating    SiCp/Cu    hot-pressing sintering    thermal conductivity
收稿日期: 2015-04-20      出版日期: 2016-08-23
中图分类号:  TB333  
通讯作者: 白书欣(1964-),男,教授,研究方向:电子封装材料,磁性材料等,联系地址:湖南省长沙市开福区国防科学技术大学一院五系(410073),joge.jk@126.com     E-mail: joge.jk@126.com
引用本文:   
刘猛, 白书欣, 李顺, 赵恂, 熊德赣. 界面改性对SiCp/Cu复合材料热物理性能的影响[J]. 材料工程, 2016, 44(8): 11-16.
LIU Meng, BAI Shu-xin, LI Shun, ZHAO Xun, XIONG De-gan. Effect of Interfacial Modifying on Thermo-physical Properties of SiCp/Cu Composites. Journal of Materials Engineering, 2016, 44(8): 11-16.
链接本文:  
http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2016.08.002      或      http://jme.biam.ac.cn/CN/Y2016/V44/I8/11
[1] SCHUBERT T,BRENDEL A,SCHMID K,et al.Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications[J].Composites Part A:Applied Science and Manufacturing,2007,38(12):2398-2403.
[2] WANG C C,MIN G H,KANG S B.Thermal conducting property of SiCp-reinforced copper matrix composites by hot pressing[J].Compos Mater,2011,45(18):1849-1852.
[3] ORDONEX S,GARVAJIAL L,MARTINEZ V,et al.Fracture toughness of SiC-Cu based alloys cermets[J].Materials Science Forum,2005,498-499:350-356.
[4] SUNBERG G,PSUL P,SUNG C,et al.Fabrication of CuSiC metal matrix composites[J].Journal of Materials Science,2006,41(2):485-504.
[5] WANG Z M,WYNBLATT P.Study of a reaction at the solid Cu/α-SiC interface[J].Journal of Materials Science,1998,33(5):1177-1181.
[6] SCHUBERT T,TRINDADE B.Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications[J].Mater Sci Eng:A,2008,475(122):39-44.
[7] 章林,曲选辉,何新波,等.高体积分数SiC/Cu复合材料的研究进展[J].粉末冶金技术,2008,26(3):224-229. ZHANG L,QU X H,HE X B,et al.Study on the SiC/Cu composites with high volume friction[J].Powder Metallurgy Technology,2008,26(3):224-229.
[8] MARTINEZ V,ORDONEZ S,CASTRO F,et al.Wetting of silicon carbide by copper alloys[J].Journal of Materials Science,2003,38(19):4047-4054.
[9] 禹胜林,薛松柏,尹邦跃,等.Al-Si电子封装材料粉末冶金法致密性研究[J].材料工程,2014,(2):45-50. YU S L,XUE S B,YIN B Y,et al.Sintering densification of Al-Si composite by powder metallurgy method for electronic packaging[J].Journal of Materials Engineering,2014,(2):45-50.
[10] SUNBERG G.Identification and characterization of diffusion barriers for Cu/SiC systems[J].Journal of Materials Science,2005,40(13):3383-3393.
[11] ZHAN Y Z,ZHANG G D.The effect of interfacial modifying on the mechanical and wear properties of SiCp/Cu composites[J].Materials Letters,2003,57(29):4583-4591.
[12] 王大伟,王美丽,李中翔,等.溶胶-凝胶法制备BiFeO3粉体及其表征[J].材料工程,2014,(12):50-54. WANG D W,WANG M L,LI Z X,et al.Preparation and characterization of BiFeO3 powders by sol-gel method[J].Journal of Materials Engineering,2014,(12):50-54.
[13] 黄伯云,李成功,石力开,等.中国材料工程大典.第5卷.有色金属材料工程(下)[M].北京:化学工业出版社,2006.
[14] HASSELMAN D P H,JOHNSON L F.Effective thermal conductivity of composites with interfacial thermal barrier resistance[J].Compos Mater,1987,21:508-515.
[15] 刘猛,白书欣,李顺,等.界面设计对Sip/Al复合材料组织和性能的影响[J].材料工程,2014,(8):61-66. LIU M,BAI S X,LI S,et al.Effects of interface design on microstructure and properties of Sip/Al composites[J].Journal of Materials Engineering,2014,(8):61-66.
[16] 褚克,贾成厂.高导热复合材料导热性能的研究[D].北京:北京科技大学,2009.
[1] 李进, 候冰娜, 韩超越, 倪凯, 赵梓年, 李征征. 可注射乙酰化乙二醇壳聚糖/泊洛沙姆复合水凝胶的制备及药物缓释研究[J]. 材料工程, 2020, 48(5): 83-90.
[2] 白明洁, 刘金龙, 齐志娜, 何江, 魏俊俊, 苗建印, 李成明. 石墨烯纳米流体研究进展[J]. 材料工程, 2020, 48(4): 46-59.
[3] 代晓腾, 马鸣龙, 张奎, 李永军, 袁家伟, 刘小稻, 王胜青. Ce对铸态Mg-6Zn合金组织与导热性能的影响[J]. 材料工程, 2020, 48(1): 92-97.
[4] 徐斌, 陈程华, 张彩霞, 鲁聪达, 倪忠进. 热分解法制备Cu空心微球及其光热转换性能[J]. 材料工程, 2019, 47(7): 57-63.
[5] 毕松, 汤进, 王鑫, 侯根良, 李军, 刘朝辉, 苏勋家. 共沉淀过程中镍锌添加比例对两步法制备的Ni0.5Zn0.5Fe2O4吸波性能的影响[J]. 材料工程, 2019, 47(4): 91-96.
[6] 刘明, 严继康, 杨钢, 姜贵民, 杜景红, 甘国友, 易健宏. 铜掺杂纳米二氧化钛颗粒的相变研究[J]. 材料工程, 2019, 47(4): 105-112.
[7] 胡安俊, 龙剑平, 舒朝著. 设计稳定和可逆的锂-空气电池阴极催化剂的研究进展[J]. 材料工程, 2019, 47(3): 30-41.
[8] 洪秋, 万隆, 李建伟. 溶胶-凝胶法制备金刚石/陶瓷结合剂复合烧结体及其性能表征[J]. 材料工程, 2019, 47(12): 130-135.
[9] 余煜玺, 马锐, 王贯春, 张瑞谦, 彭小明. 高比表面积、低密度块状Al2O3气凝胶的制备及表征[J]. 材料工程, 2019, 47(12): 136-142.
[10] 田晋, 高立, 蔡滨, 齐泽昊, 谭业发. 功能化纳米SiO2改性环氧树脂复合材料及其摩擦磨损行为与机制[J]. 材料工程, 2019, 47(11): 92-99.
[11] 杨唐俊, 袁荞龙, 黄发荣. 石英纤维增强含硅芳炔树脂复合材料的界面增强[J]. 材料工程, 2018, 46(8): 148-155.
[12] 陈义川, 胡跃辉, 胡克艳, 张效华, 童帆, 帅伟强, 劳子轩. 共掺浓度对Na-Al共掺杂ZnO薄膜微观结构和光电性能的影响[J]. 材料工程, 2018, 46(6): 51-56.
[13] 于长清, 陈利, 裴雨辰. 碳纤维表面涂层对碳纤维增强锂铝硅玻璃陶瓷复合材料热导率的影响[J]. 材料工程, 2018, 46(6): 101-105.
[14] 左银泽, 陈亮, 朱斌, 高延敏. 纳米氧化锌负载氧化石墨烯/环氧树脂复合材料性能研究[J]. 材料工程, 2018, 46(5): 22-28.
[15] 王莹, 李勇, 朱靖, 赵亚茹, 李焕. 氧化石墨烯表面稀土改性机理[J]. 材料工程, 2018, 46(5): 29-35.
Viewed
Full text


Abstract

Cited

  Shared   
  Discussed   
版权所有 © 2015《材料工程》编辑部
地址:北京81信箱44分箱 邮政编码: 100095
电话:010-62496276 E-mail:matereng@biam.ac.cn
本系统由北京玛格泰克科技发展有限公司设计开发 技术支持:support@magtech.com.cn