1. School of Materials Science and Engineering, Nanchang University, Nanchang, 330031, China; 2. School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang, 330063, China
Abstract：Effects of P addition on the properties of Sn-9Zn eutectic lead-free solder alloy have been studied.The results show that P could significantly improve the wettability of Sn-9Zn to Cu because P addition can decrease the content of oxygen in Sn-Zn alloy by the application of Secondary Ion Mass Spectrometry(SIMS) analysis.P addition enhances the creep strength of the Sn-9Zn bulk materials and the shear strength of Sn-9Zn/Cu joints,while decreases its ductility.No significant change in the interfacial structure of Sn-9Zn/Cu joints was observed by addition of P.The mechanisms were also discussed.
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2010, Vol. 0 
