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材料工程  2016, Vol. 44 Issue (9): 44-51    DOI: 10.11868/j.issn.1001-4381.2016.09.007
  材料与工艺 本期目录 | 过刊浏览 | 高级检索 |
耐高温双马来酰亚胺树脂的固化反应动力学和TTT图
李伟东1, 张金栋2, 李韶亮3, 刘刚1, 钟翔屿1, 包建文1
1 中航复合材料有限责任公司, 北京 101300;
2 核工业理化工程研究院, 天津 300180;
3 空军驻北京地区军事代表室, 北京 101300
Curing Kinetics and TTT Diagram of High Temperature Resistance Bismaleimide Resin
LI Wei-dong1, ZHANG Jin-dong2, LI Shao-liang3, LIU Gang1, ZHONG Xiang-yu1, BAO Jian-wen1
1 AVIC Composite Corporation Ltd., Beijing 101300, China;
2 Research Institute of Physical and Chemical Engineering of Nuclear Industry, Tianjin 300180, China;
3 Air Force Military Representative Office in Beijing Region, Beijing 101300, China
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摘要 采用动态DSC法对耐高温双马来酰亚胺树脂的固化反应动力学进行研究,根据Kissinger方程和Crane方程,拟合得到树脂的固化动力学参数,并建立树脂的唯象模型。此外,采用恒温DSC法,根据DiBenedetto方程,建立树脂的玻璃化转变温度与固化度之间的函数关系。采用凝胶盘法,获得树脂在不同温度下的凝胶时间,建立凝胶时间和凝胶温度之间的函数关系,最终得到树脂的TTT图。结果表明:根据TTT图确定合适的加压时机,可以有效排除夹杂于预浸料层内层间的气体,从而制备内部质量完好的复合材料。
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李伟东
张金栋
李韶亮
刘刚
钟翔屿
包建文
关键词 双马来酰亚胺树脂固化反应动力学TTT图工艺优化    
Abstract:The curing kinetics of high temperature resistance bismaleimide resin was studied by dynamic DSC analysis, and the parameters of the curing reaction were obtained to establish a phenomenological model based on Kissinger and Crane equations. The relationship between glass transition temperature and curing degree was analyzed with isothermal DSC method based on DiBenedetto equation. Moreover, the relationship between gel-time and temperature was investigated by gelation disk. Finally, the time-temperature-transition (TTT) diagram was built to guide the process of the resin. Results show that appropriate pressure timing can be determined according to the TTT diagram. Thus, air in or between layers of prepreg can be eliminated effectively to prepare composites with good internal quality.
Key wordsbismaleimide resin    curing kinetics    TTT diagram    process optimization
收稿日期: 2016-03-08      出版日期: 2016-09-27
中图分类号:  TB332  
通讯作者: 刘刚(1978-),男,博士,研究员,主要从事树脂基复合材料相关研究,联系地址:北京市81信箱3分箱(100095),E-mail:liugang@iccas.ac.cn     E-mail: liugang@iccas.ac.cn
引用本文:   
李伟东, 张金栋, 李韶亮, 刘刚, 钟翔屿, 包建文. 耐高温双马来酰亚胺树脂的固化反应动力学和TTT图[J]. 材料工程, 2016, 44(9): 44-51.
LI Wei-dong, ZHANG Jin-dong, LI Shao-liang, LIU Gang, ZHONG Xiang-yu, BAO Jian-wen. Curing Kinetics and TTT Diagram of High Temperature Resistance Bismaleimide Resin. Journal of Materials Engineering, 2016, 44(9): 44-51.
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http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2016.09.007      或      http://jme.biam.ac.cn/CN/Y2016/V44/I9/44
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