Microstructure and mechanical property of full Cu3Sn solder joints during high-temperature aging
Yangyang ZHU, Xiaoyan LI, Weidong ZHANG, Hu ZHANG, Xi HE
Journal of Materials Engineering ›› 2022, Vol. 50 ›› Issue (9) : 169-176.
Microstructure and mechanical property of full Cu3Sn solder joints during high-temperature aging
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