Digital-to-analog resistive switching depending on thickness of CeO2-x-TiO2 films

LI Zihao, HU Lifang, GAO Wei, JIA Xu, ZHENG Zhi, LIU Wei

Journal of Materials Engineering ›› 2023, Vol. 51 ›› Issue (2) : 141-151.

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Journal of Materials Engineering ›› 2023, Vol. 51 ›› Issue (2) : 141-151. DOI: 10.11868/j.issn.1001-4381.2022.000166
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Digital-to-analog resistive switching depending on thickness of CeO2-x-TiO2 films

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(2): 141-151 https://doi.org/10.11868/j.issn.1001-4381.2022.000166

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