Microstructure of DD15/SC-4 dual-alloy hot isostatic pressure diffusion bonding joint

LIU Haoming, DING fangzheng, JIANG Kanghe, LIU Jian, LIU Shizhong, PENG Zichao, WANG Xuqing

Journal of Materials Engineering ›› 2026, Vol. 54 ›› Issue (2) : 222-233.

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Journal of Materials Engineering ›› 2026, Vol. 54 ›› Issue (2) : 222-233. DOI: 10.11868/j.issn.1001-4381.2024.000755
RESEARCH ARTICLE

Microstructure of DD15/SC-4 dual-alloy hot isostatic pressure diffusion bonding joint

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 54(2): 222-233 https://doi.org/10.11868/j.issn.1001-4381.2024.000755

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