Preparation and microstructure evolution of AuSn20 solder ball based on pulsated orifice ejection method

DONG Wei, GE Fengyue, XU Fumin

Journal of Materials Engineering ›› 2026, Vol. 54 ›› Issue (9) : 91-98.

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Journal of Materials Engineering ›› 2026, Vol. 54 ›› Issue (9) : 91-98. DOI: 10.11868/j.issn.1001-4381.2024.000864

Preparation and microstructure evolution of AuSn20 solder ball based on pulsated orifice ejection method

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 54(9): 91-98 https://doi.org/10.11868/j.issn.1001-4381.2024.000864

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