Curing kinetics simulation and curing process design for bismaleimide resin

ZOU Qi, LIU Yanfeng, QING Xinlin, ZHANG Daijun

Journal of Materials Engineering ›› 2026, Vol. 54 ›› Issue (5) : 264-271.

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Journal of Materials Engineering ›› 2026, Vol. 54 ›› Issue (5) : 264-271. DOI: 10.11868/j.issn.1001-4381.2025.000398

Curing kinetics simulation and curing process design for bismaleimide resin

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 54(5): 264-271 https://doi.org/10.11868/j.issn.1001-4381.2025.000398

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