The Electroless Plating Process for Nickel with High Depositing Speed and Stable Electrolyte

Li Songmei, Guan Shan, Hu Runan

Journal of Materials Engineering ›› 1998, Vol. 0 ›› Issue (7) : 30-33,43.

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Journal of Materials Engineering ›› 1998, Vol. 0 ›› Issue (7) : 30-33,43.

The Electroless Plating Process for Nickel with High Depositing Speed and Stable Electrolyte

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 1998, 0(7): 30-33,43

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