
The Microstructure and Properties of TLP Diffusion Bonding Joints of TC4 Alloys
CHENG Yao-yong, MA Wen-li, GUO Wan-lin
Journal of Materials Engineering ›› 1999, Vol. 0 ›› Issue (12) : 31-34.
The Microstructure and Properties of TLP Diffusion Bonding Joints of TC4 Alloys
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