Recovery of Chips of SiCw/6061Al Composites by Hot Compression

JIANG Chuan-hai, WANG De-zun, ZHANG Wen-long, YAO Zhong-kai

Journal of Materials Engineering ›› 2000, Vol. 0 ›› Issue (2) : 31-33.

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PDF(183 KB)
Journal of Materials Engineering ›› 2000, Vol. 0 ›› Issue (2) : 31-33.

Recovery of Chips of SiCw/6061Al Composites by Hot Compression

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2000, 0(2): 31-33

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