Study on Properties of SY-H2 Medium Temperature Curing Paste Adhesive

QIAO Hai-tao, LAI Shi-hong, ZOU Xian-wu

Journal of Materials Engineering ›› 2002, Vol. 0 ›› Issue (7) : 27-28,32.

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Journal of Materials Engineering ›› 2002, Vol. 0 ›› Issue (7) : 27-28,32.

Study on Properties of SY-H2 Medium Temperature Curing Paste Adhesive

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2002, 0(7): 27-28,32

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