Thermal Shock Damage Behaviour of 3D-C/SiC

REN Wei-hua, QIAO Sheng-ru, AO Qiang

Journal of Materials Engineering ›› 2003, Vol. 0 ›› Issue (12) : 26-28.

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Journal of Materials Engineering ›› 2003, Vol. 0 ›› Issue (12) : 26-28.

Thermal Shock Damage Behaviour of 3D-C/SiC

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2003, 0(12): 26-28

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