Studies on Rheological Behavior of Bismaleimide Resin for Resin Transfer Molding
LI Xiaogang, LI Hongyun, HU Hongjun, YI Xiaosu
Journal of Materials Engineering ›› 2003, Vol. 0 ›› Issue (6) : 11-14.
Studies on Rheological Behavior of Bismaleimide Resin for Resin Transfer Molding
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