High Temperature Bonding Properties of Modified Phenol-formaldehyde Resin Matrix Adhesive

WANG Ji-gang, GUO Quan-gui, LIU Lang, BAI Shi-hong, QIAO Sheng-ru

Journal of Materials Engineering ›› 2004, Vol. 0 ›› Issue (12) : 12-15.

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Journal of Materials Engineering ›› 2004, Vol. 0 ›› Issue (12) : 12-15.

High Temperature Bonding Properties of Modified Phenol-formaldehyde Resin Matrix Adhesive

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2004, 0(12): 12-15

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