Building of Cure Kinetic Model in Modified Bismeleimide Resin During Curing Process

YU Jia, WANG Zhen-qing, ZHANG Bo-ming, WANG Dian-fu, ZHANG Bao-yan, CHEN Xiang-bao

Journal of Materials Engineering ›› 2005, Vol. 0 ›› Issue (4) : 55-59.

PDF(618 KB)
PDF(618 KB)
Journal of Materials Engineering ›› 2005, Vol. 0 ›› Issue (4) : 55-59.

Building of Cure Kinetic Model in Modified Bismeleimide Resin During Curing Process

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2005, 0(4): 55-59

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