Microstructure and Mechanical Properties of Cladding Copper-steel Wire by Drawing at Room Temperature

WU Yunzhong, MA Yongqing, GAO Hongtao, ZHAN Yang, LIU Shiyong

Journal of Materials Engineering ›› 2006, Vol. 0 ›› Issue (10) : 19-22.

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PDF(1075 KB)
Journal of Materials Engineering ›› 2006, Vol. 0 ›› Issue (10) : 19-22.

Microstructure and Mechanical Properties of Cladding Copper-steel Wire by Drawing at Room Temperature

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2006, 0(10): 19-22

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