Numerical Simulation to the Process of Solid Phase Bonding for Cu/Al Bimetal Composite by Hydrostatic Extrusion

ZHANG Zhaohui, LIAO Qiujin, CHENG Jingwei, WANG Fuchi

Journal of Materials Engineering ›› 2006, Vol. 0 ›› Issue (10) : 34-36,51.

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Journal of Materials Engineering ›› 2006, Vol. 0 ›› Issue (10) : 34-36,51.

Numerical Simulation to the Process of Solid Phase Bonding for Cu/Al Bimetal Composite by Hydrostatic Extrusion

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2006, 0(10): 34-36,51

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