The Effect on Thermal Stability of Polyimide Films Based on Phthalimide End-capped ODPA and ODA

CHENG Ru, HUANG Pei, SHI Jun

Journal of Materials Engineering ›› 2006, Vol. 0 ›› Issue (7) : 7-10.

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PDF(186 KB)
Journal of Materials Engineering ›› 2006, Vol. 0 ›› Issue (7) : 7-10.

The Effect on Thermal Stability of Polyimide Films Based on Phthalimide End-capped ODPA and ODA

  • CHENG Ru, HUANG Pei, SHI Jun
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Abstract

Polyimide films capped with nonreactive phthalimide end groups were synthesized with theoretical number average molecular mass of 10000 and 30000 calculated using the Carothers equation.The effect of end-capper on the thermal properties was studied by investigating the change of the glass transition temperature(Tg) of films after cured at high temperature.The Gel Permeation Chromatography(GPC) results indicated that the molecular distribution of end capped PAA was smaller than that of the no end-capped one.The Differential Scanning Calorimetry(DSC) results showed PA end-capped polyimide films exhibited slower rising range of the Tg compared to no end cappers films'.With the increasing of curing time,the Tg of the short chain film increased slowly,which of the long chain film increased straightly.The end capper's effect was explained based on polymerization at high temperature,chain branching/crossing-linking reactions and molecular activity.

Key words

polyimide film / thermal stability / glass transition temperature

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CHENG Ru, HUANG Pei, SHI Jun. The Effect on Thermal Stability of Polyimide Films Based on Phthalimide End-capped ODPA and ODA[J]. Journal of Materials Engineering, 2006, 0(7): 7-10

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