Effect of Long Time Thermal Exposure on Microstructures of Al-Cu-Mg-Ag Alloy

ZHANG Kun, DAI Sheng-long, HUANG Min, YAN Ming-gao

Journal of Materials Engineering ›› 2007, Vol. 0 ›› Issue (11) : 15-19.

PDF(754 KB)
PDF(754 KB)
Journal of Materials Engineering ›› 2007, Vol. 0 ›› Issue (11) : 15-19.

Effect of Long Time Thermal Exposure on Microstructures of Al-Cu-Mg-Ag Alloy

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2007, 0(11): 15-19

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(754 KB)

Accesses

Citation

Detail

Sections
Recommended

/