Study on Annealing Process and Microstructure and Properties of Cold-drawing Copper Cladding Aluminum Thin Wires

WANG Qiu-na, LIU Xin-hua, LIU Xue-feng, XIE Jian-xin

Journal of Materials Engineering ›› 2008, Vol. 0 ›› Issue (7) : 30-35.

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PDF(1006 KB)
Journal of Materials Engineering ›› 2008, Vol. 0 ›› Issue (7) : 30-35.

Study on Annealing Process and Microstructure and Properties of Cold-drawing Copper Cladding Aluminum Thin Wires

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2008, 0(7): 30-35

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