Study on Wettability of Sn-Ag-Cu-Ce Solder and Mechanical Properties of Soldered Joints

WANG Jian-xin, XUE Song-bai, HAN Zong-jie, YU Sheng-lin, CHEN Yan

Journal of Materials Engineering ›› 2008, Vol. 0 ›› Issue (9) : 5-8.

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PDF(556 KB)
Journal of Materials Engineering ›› 2008, Vol. 0 ›› Issue (9) : 5-8.

Study on Wettability of Sn-Ag-Cu-Ce Solder and Mechanical Properties of Soldered Joints

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2008, 0(9): 5-8

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