Influences of K4Fe(CN)6 on Electroless Copper Plating Using Hypophosphite as Reducing Agent

GAN Xue-ping

Journal of Materials Engineering ›› 2009, Vol. 0 ›› Issue (4) : 39-44.

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Journal of Materials Engineering ›› 2009, Vol. 0 ›› Issue (4) : 39-44.

Influences of K4Fe(CN)6 on Electroless Copper Plating Using Hypophosphite as Reducing Agent

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 0(4): 39-44

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