Investigation on the Wettability and Interfacial Structure of Sn-9Zn-xAg Solders on Cu Substrate

HU Yuhua, XUE Songbai, CHEN Wenxue, WANG Hui

Journal of Materials Engineering ›› 2009, Vol. 0 ›› Issue (6) : 60-63.

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Journal of Materials Engineering ›› 2009, Vol. 0 ›› Issue (6) : 60-63.

Investigation on the Wettability and Interfacial Structure of Sn-9Zn-xAg Solders on Cu Substrate

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 0(6): 60-63

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