Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements

LIU Bin, TAI Feng, GUO Fu, XIA Zhi-dong, SHI Yao-wu

Journal of Materials Engineering ›› 2009, Vol. 0 ›› Issue (8) : 38-42,48.

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Journal of Materials Engineering ›› 2009, Vol. 0 ›› Issue (8) : 38-42,48.

Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 0(8): 38-42,48

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