Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements

LIU Bin, TAI Feng, GUO Fu, XIA Zhi-dong, SHI Yao-wu

Journal of Materials Engineering ›› 2009, Vol. 0 ›› Issue (8) : 38-42,48.

PDF(2283 KB)
PDF(2283 KB)
Journal of Materials Engineering ›› 2009, Vol. 0 ›› Issue (8) : 38-42,48.

Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 0(8): 38-42,48

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(2283 KB)

Accesses

Citation

Detail
Sections
Recommended

/

〈 〉