Filling and Wetting Behaviors of Liquid Filler Metal in the Process of Ultrasonic Soldering of Aluminum Alloy

XU Zhiwu, YAN Jiuchun, ZHONG Li, YANG Shiqin

Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 1-4,8.

PDF(1072 KB)
  • Ei，ESCI收录期刊
  • 中国科学引文数据库(CSCD)核心期刊
  • 中文核心期刊
  • 文摘与引文数据库(Scopus)
  • 剑桥科学文摘(CSA)
PDF(1072 KB)
Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 1-4,8.

Filling and Wetting Behaviors of Liquid Filler Metal in the Process of Ultrasonic Soldering of Aluminum Alloy

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 0(10): 1-4,8

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1072 KB)

Accesses

Citation

Detail
Sections
Recommended

/

〈 〉