Filling and Wetting Behaviors of Liquid Filler Metal in the Process of Ultrasonic Soldering of Aluminum Alloy

XU Zhiwu, YAN Jiuchun, ZHONG Li, YANG Shiqin

Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 1-4,8.

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Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 1-4,8.

Filling and Wetting Behaviors of Liquid Filler Metal in the Process of Ultrasonic Soldering of Aluminum Alloy

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 0(10): 1-4,8

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