Research of Intermetallic Compounds at Interface of Sn2.5Ag0.7CuxRE Solder Joints During Aging

ZHANG Keke, HAN Lijuan, WANG Yaoli, ZHANG Xin, ZHU Yaomin

Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 18-21,37.

PDF(1054 KB)
PDF(1054 KB)
Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 18-21,37.

Research of Intermetallic Compounds at Interface of Sn2.5Ag0.7CuxRE Solder Joints During Aging

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 0(10): 18-21,37

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1054 KB)

Accesses

Citation

Detail
Sections
Recommended

/

〈 〉