Growth Kinetic of Intermetallic Compounds and Failure Behavior for SnAgCu/Cu Solder Joints Subjected to Thermal Cycling

XIAO Hui, LI Xiaoyan, LI Fenghui

Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 38-42.

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Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 38-42.

Growth Kinetic of Intermetallic Compounds and Failure Behavior for SnAgCu/Cu Solder Joints Subjected to Thermal Cycling

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 0(10): 38-42

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