Investigations on Melting Property,Wettability and Mechanical Property of Sn-XAg-0.5Cu Lead-free Solder Alloys

WEI Guoqiang, WAN Zhonghua, ZHAO Siyong, ZHANG Yupeng, LIU Fengmei

Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 53-56.

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PDF(765 KB)
Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 53-56.

Investigations on Melting Property,Wettability and Mechanical Property of Sn-XAg-0.5Cu Lead-free Solder Alloys

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 0(10): 53-56

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