Effect of Solidification Mode on Microstructure and Properties of Sn-Bi Solders

LU Xiaochun, HE Peng, ZHANG Binbin, MA Xin, QIAN Yiyu

Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 89-95.

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Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (10) : 89-95.

Effect of Solidification Mode on Microstructure and Properties of Sn-Bi Solders

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 0(10): 89-95

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