Debond in Small Curvature Adhesion Structure Detected by Thermal Wave Nondestructive Testing

YANG Zheng-wei, ZHANG Wei, TIAN Gan, SONG Yuan-jia, JIN Guo-feng

Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (12) : 39-43.

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Journal of Materials Engineering ›› 2010, Vol. 0 ›› Issue (12) : 39-43.

Debond in Small Curvature Adhesion Structure Detected by Thermal Wave Nondestructive Testing

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 0(12): 39-43

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