Effect of Temperature Gradient on Primary Dendrite Spacing During Directional Solidification of Al-4.5%Cu Alloy

SI Nai-chao, XU Neng-jun, SI Song-hai, LI Yun-da, SHI Jian

Journal of Materials Engineering ›› 2011, Vol. 0 ›› Issue (4) : 75-79.

PDF(1350 KB)
PDF(1350 KB)
Journal of Materials Engineering ›› 2011, Vol. 0 ›› Issue (4) : 75-79.

Effect of Temperature Gradient on Primary Dendrite Spacing During Directional Solidification of Al-4.5%Cu Alloy

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2011, 0(4): 75-79

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1350 KB)

Accesses

Citation

Detail

Sections
Recommended

/