Influences of Al Content in Packing on Microstructure and Properties of Cr-Al Coating on Cu Substrate Electrodeposited Nickel Layer

WANG Hong-xing, LI Ying-guang, CHU Cheng-lin

Journal of Materials Engineering ›› 2011, Vol. 0 ›› Issue (7) : 49-55.

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Journal of Materials Engineering ›› 2011, Vol. 0 ›› Issue (7) : 49-55.

Influences of Al Content in Packing on Microstructure and Properties of Cr-Al Coating on Cu Substrate Electrodeposited Nickel Layer

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2011, 0(7): 49-55

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