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材料工程  2020, Vol. 48 Issue (10): 133-140    DOI: 10.11868/j.issn.1001-4381.2019.000691
  研究论文 本期目录 | 过刊浏览 | 高级检索 |
AlNP/Al复合材料与6061Al低温连接组织演变机理及力学性能
林盼盼1, 马典1, 李昊岳1, 王子鸣1, 何鹏1, 林铁松1, 龙伟民2
1. 哈尔滨工业大学 先进焊接与连接国家重点实验室, 哈尔滨 150001;
2. 郑州机械研究所 新型钎焊材料与技术国家重点实验室, 郑州 450001
Microstructure evolution mechanism and mechanical properties of AlNP/Al composites bonded to 6061Al at low temperature
LIN Pan-pan1, MA Dian1, LI Hao-yue1, WANG Zi-ming1, HE Peng1, LIN Tie-song1, LONG Wei-min2
1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
2. State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China
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摘要 为了防止在高温下连接电子器件发生破坏,并改善常用的低温SnAgCu钎料对母材25%(体积分数) AlNP/Al复合材料与6061Al合金表面的润湿性,对母材表面进行磁控溅射Ni薄层或Ti/Ni双金属薄层的预金属化处理,再用SnAgCu钎料进行连接,可得到结合良好的接头。双金属化后接头两侧界面组成为母材/Ti-Al/Ti/Ti-Ni/Ni/Ni-Sn-Cu/β-Sn+Ag3Sn。不同元素之间扩散速率的差异导致了界面反应层不同位置的物相成分差异,从镀Ni层向焊缝中心方向,反应层的物相呈(Ni,Cu)3Sn,(Ni,Cu)3Sn2,(Ni,Cu)6Sn5,(Ni,Cu)3Sn4的变化趋势。Ti元素的加入可显著提高镀Ni层与母材的结合力,在250℃下保温1~5 min,钎焊双金属化处理后的母材所得接头抗剪强度可达28~35 MPa,断裂发生在β-Sn基体中。
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林盼盼
马典
李昊岳
王子鸣
何鹏
林铁松
龙伟民
关键词 磁控溅射AlNP/Al复合材料低温钎焊SnAgCu钎料微观组织力学性能    
Abstract:In order to prevent the damage of the connected electronic components at high temperature and improve the wettability of the commonly used low-temperature SnAgCu(SAC) solder on the surface of the base material 25%AlNP/Al(volume fraction) composite and 6061Al alloy, the Ni thin layer or the Ti/Ni bimetal thin layer on the surface of the base metal were pre-metallized by magnetron sputtering, and then connected with a SnAgCu solder, a well-bonded joints was obtained. After double metallization, the interface on both sides of the joint is composed of base material /Ti-Al/Ti/Ti-Ni/Ni/Ni-Sn-Cu/β-Sn+Ag3Sn. The difference in diffusion speed between different elements leads to differences in the phase composition of the interface reaction layer at different positions. From the Ni plating layer to the center of the weld, the phase of the reaction layer is (Ni,Cu)3Sn, (Ni,Cu)3Sn2, (Ni,Cu)6Sn5, (Ni,Cu)3Sn4. The addition of Ti element can significantly improve the bonding strength between the Ni-plated layer and the base metal. The joint shear strength of the joint material obtained by brazing the base metal after double metallization at 250 ℃ for 1 min to 5 min can reach 28-35 MPa, fracture occurs at β-Sn matrix.
Key wordsmagnetron sputtering    AlNP/Al composite material    low temperature brazing    SnAgCu solder    microstructure    mechanical property
收稿日期: 2019-07-23      出版日期: 2020-10-17
中图分类号:  TG425.1  
通讯作者: 林铁松(1978-),男,教授,博士,研究方向:新材料及异种材料连接,联系地址:黑龙江省哈尔滨市南岗区西大直街92号哈尔滨工业大学材料学院(150001),E-mail:hitjoining@hit.edu.cn     E-mail: hitjoining@hit.edu.cn
引用本文:   
林盼盼, 马典, 李昊岳, 王子鸣, 何鹏, 林铁松, 龙伟民. AlNP/Al复合材料与6061Al低温连接组织演变机理及力学性能[J]. 材料工程, 2020, 48(10): 133-140.
LIN Pan-pan, MA Dian, LI Hao-yue, WANG Zi-ming, HE Peng, LIN Tie-song, LONG Wei-min. Microstructure evolution mechanism and mechanical properties of AlNP/Al composites bonded to 6061Al at low temperature. Journal of Materials Engineering, 2020, 48(10): 133-140.
链接本文:  
http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2019.000691      或      http://jme.biam.ac.cn/CN/Y2020/V48/I10/133
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