热处理对TiAl/Ti<sub>2</sub>AlNb放电等离子扩散焊接头微观组织与力学性能的影响

doi:10.11868/j.issn.1001-4381.2019.000866

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摘要

采用放电等离子扩散连接方法，实现了TiAl/Ti₂AlNb合金扩散连接，对焊后的接头进行不同温度的热处理，分析热处理后接头显微组织，并检测接头抗拉强度和显微硬度。结果表明：热处理后Ti₂AlNb母材、TiAl母材和界面处显微形貌无明显变化；Ti₂AlNb热影响区发生B2相向O相转变，由于针状O相的析出，热影响区的显微硬度较焊态显著增加。随着热处理温度的升高，Ti₂AlNb热影响区的显微硬度逐渐减小，接头的室温抗拉强度逐渐增加。当热处理温度为900℃时，接头抗拉强度最大为376 MPa。热处理后接头的断裂方式为脆性断裂。

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	吕彦龙
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关键词 ：放电等离子扩散焊, TiAl, Ti₂AlNb, 抗拉强度, 显微硬度

Abstract：

TiAl/Ti₂AlNb dissimilar alloys were successfully bonded together by spark plasma diffusion bonding. The joints were subjected to post-weld heat treatment at different temperatures. The microstructure of the welded joint was analyzed and the tensile strength and microhardness of the joint were tested. The results indicate that after heat treatment, the microstructure of Ti₂AlNb base metal, TiAl base metal and interface has no obvious change. In the Ti₂AlNb heat affected zone(HAZ), most B2 phase gradually turns into O phase, due to the precipitation of acicular O phase, the microhardness increases significantly compared to as welded condition. With the increase of heat treatment temperature, the microhardness of the Ti₂AlNb HAZ gradually decreases, meanwhile, the tensile strength of the joint at room temperature shows an evident increase compared to as welded. The maximum tensile strength of the joint reaches 376 MPa at heat treatment temperature of 900℃. After heat treatment, the fracture mode of the joint is brittle fracture.

Key words： spark plasma diffusion bonding TiAl Ti₂AlNb tensile strength microhardness

收稿日期: 2019-09-22 出版日期: 2021-09-17

中图分类号:

TG456

基金资助:国家自然科学基金项目(91860115)

通讯作者: 吕彦龙 E-mail: lvyanlong0210@126.com

作者简介: 吕彦龙(1993-), 男, 工程师, 研究方向为金属材料的钎焊、扩散焊, 联系地址: 北京市朝阳区东军庄1号中国航空制造技术研究院(100024), E-mail: lvyanlong0210@126.com

引用本文:

吕彦龙, 贺建超, 侯金保, 张博贤. 热处理对TiAl/Ti₂AlNb放电等离子扩散焊接头微观组织与力学性能的影响[J]. 材料工程, 2021, 49(9): 87-93.
Yan-long LYU, Jian-chao HE, Jin-bao HOU, Bo-xian ZHANG. Effect of heat treatment on microstructure and mechanical properties of TiAl/Ti₂AlNb joint by spark plasma diffusion bonding. Journal of Materials Engineering, 2021, 49(9): 87-93.

链接本文:

http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2019.000866 或 http://jme.biam.ac.cn/CN/Y2021/V49/I9/87

Fig.1 母材原始显微组织
(a)TiAl；(b)Ti₂AlNb

Fig.2 放电等离子焊接示意图

Fig.3 焊态和不同温度热处理状态下接头的金相显微组织
(a)焊态; (b)750 ℃; (c)800 ℃; (d)850 ℃; (e)900 ℃

Fig.4 850 ℃热处理条件下接头SEM显微组织

Table 1 图 4各区域EDS分析结果(原子分数/%)

Fig.5 不同热处理温度下接头SEM显微组织
(a)800 ℃; (b)900 ℃

Fig.6 不同状态下焊接接头显微硬度

Table 2 不同状态下接头的室温抗拉强度

Fig.7 接头断口的截面形貌
(a)焊态；(b)800 ℃热处理；(c)900 ℃热处理

Fig.8 不同状态下断口的SEM形貌
(a)焊态；(b)800 ℃热处理；(c)900 ℃热处理

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