Novel Cyanate Ester Resin Composites for Microelectrical Packaging
XUE Jie1, YE Ju-hua2, GUAN Qing-bao2, LIU Ping2, LIANG Guo-zheng2
1. Department of Pharmacology,College of Pharmaceutical Science,Soochow University,Suzhou 215123,Jiangsu,China; 2. Department of Materials Science and Engineering,Soochow University,Suzhou 215123,Jiangsu,China
Abstract：Three composites based on CE resin, aluminum nitride (AlN), nano AlN (n-AlN) and silicon dioxide (SiO2), and silane coupling agent (KH560) modified AlN and SiO2,coded as AlN/CE, n-AlN/CE, AlN-SiO2/CE and AlN(KH560)-SiO2(KH560)/CE composite, respectively, were prepared. The influences of the sort,size and surface nature of fillers on the thermal conductivity and dielectric properties of composites were investigated in detail. The results show that properties of fillers have great influence on the thermal conductivity of composites. When CE resin was filled by n-AlN and AlN,the resultant composites increased thermal conductivity due to the close arrangement.The composite with a higher content of AlN had higher dielectric constant.But when SiO2 was used to replace AlN,the increasement of dielectric constant was reduced.
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2013, Vol. 0 
