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回流冷却与等温时效过程中Sn-35Bi-1Ag/Ni-P/Cu焊点组织演变
卢汉桥, 李玉龙, 余啸, 龙维峰, 江建锋
材料工程 ›› 2018, Vol. 46 ›› Issue (6) : 95-100.
回流冷却与等温时效过程中Sn-35Bi-1Ag/Ni-P/Cu焊点组织演变
Microstructure Evolution of Sn-35Bi-1Ag/Ni-P/Cu Solder Joints During Post-reflow Cooling and Isothermal Aging
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