High temperature resistant aging stability of lead-free solder joints by TLP bonding

Zheng-bing LI, De WANG, De-an HU, Yi-ping CHEN, Dong-hai CHENG, Yi-le GUO, Kai HE, Shuo HUANG, Xiao-jun LI

Journal of Materials Engineering ›› 2021, Vol. 49 ›› Issue (10) : 82-88.

PDF(5582 KB)
  • Ei，ESCI收录期刊
  • 中国科学引文数据库(CSCD)核心期刊
  • 中文核心期刊
  • 文摘与引文数据库(Scopus)
  • 剑桥科学文摘(CSA)
PDF(5582 KB)
Journal of Materials Engineering ›› 2021, Vol. 49 ›› Issue (10) : 82-88. DOI: 10.11868/j.issn.1001-4381.2020.000853
Research Article

High temperature resistant aging stability of lead-free solder joints by TLP bonding

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 49(10): 82-88 https://doi.org/10.11868/j.issn.1001-4381.2020.000853

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(5582 KB)

Accesses

Citation

Detail
Sections
Recommended

/

〈 〉