Research progress in thermal conductivity of SiC ceramics

Bo DONG, Chao YU, Chengji DENG, Hongxi ZHU, Jun DING, Hui TANG

Journal of Materials Engineering ›› 2023, Vol. 51 ›› Issue (1) : 64-75.

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Journal of Materials Engineering ›› 2023, Vol. 51 ›› Issue (1) : 64-75. DOI: 10.11868/j.issn.1001-4381.2021.001040
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Research progress in thermal conductivity of SiC ceramics

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(1): 64-75 https://doi.org/10.11868/j.issn.1001-4381.2021.001040

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