Effect of P on Microstructure and Mechanical Properties of Sn-Bi Solder

Xiao-jing WANG, Bin LIU, Hui-ling ZHOU, Jian-xin WANG, Ning LIU, Tian-yang LI

Journal of Materials Engineering ›› 2016, Vol. 44 ›› Issue (7) : 113-118.

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Journal of Materials Engineering ›› 2016, Vol. 44 ›› Issue (7) : 113-118. DOI: 10.11868/j.issn.1001-4381.2016.07.019
Testing ' Characterizing

Effect of P on Microstructure and Mechanical Properties of Sn-Bi Solder

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 44(7): 113-118 https://doi.org/10.11868/j.issn.1001-4381.2016.07.019

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