金属配合物促进双氰胺固化环氧树脂研究

焦剑, 蓝立文

材料工程 ›› 1999, Vol. 0 ›› Issue (10) : 27-30.

PDF(342 KB)
PDF(342 KB)
材料工程 ›› 1999, Vol. 0 ›› Issue (10) : 27-30.
研究与应用

金属配合物促进双氰胺固化环氧树脂研究

  • 焦剑, 蓝立文
作者信息 +

Study on Effect of Metal-complex Accelerant to Dicyanodiamide Curing Epoxy Resin

  • JIAO Jian, LAN Li-wen
Author information +
文章历史 +

摘要

合成了三种不同过渡金属羧酸盐与咪哩的配合物。将它与一种多羟基化合物共同作为促进剂。可以有效地降低双氰肢固化环氧树脂的温度。实现中温固化,井在室温时有良好的存储期。本文通过凝胶特性的测试和差热分析(DSC).对这三种过渡金属配合物促进环氧树脂体系的固化特性进行了探讨,并测试了其复合材料的基本性能。结果表明,复合材料的性能良好,与通常应用的中温固化环氧树脂基复合材料的性能相当。

Abstract

Three kinds of transition metals salt of acetic acid and imldazole complex were synthesised. With the cooperative effect of poly-hydroxy compound, they were the effect accclerant to dicyanodiamide curing epoxy resin. These systems have lower curing temperature than dicyanodiamide curing epoxy without accelerant, can be cured at moderate temperature, and have good potlife at room temperature. Curing reaction of these three systems containing transition metal complex were investigated with gel propertics and differential scanning calorimetry (DSC). Properties of composites were lested. The results show that the curing systems had good properties andcould be used as matrix of composite.

关键词

环氧树脂 / 双氰胺 / 促进剂 / 金属配合物

Key words

epoxy / dicyanodiamide / accelerant / metal-complex

引用本文

导出引用
焦剑, 蓝立文. 金属配合物促进双氰胺固化环氧树脂研究[J]. 材料工程, 1999, 0(10): 27-30
JIAO Jian, LAN Li-wen. Study on Effect of Metal-complex Accelerant to Dicyanodiamide Curing Epoxy Resin[J]. Journal of Materials Engineering, 1999, 0(10): 27-30
中图分类号: TQ323.5   

参考文献

[1] [日]理太郎.环氧树脂用新型潜伏性固化剂[J].绝缘材料通讯.1995. (4):37-48.
[2] A. V. KURNOSKIN. Structure of the Epoxy-chelatr Metal-Containing Matrices:Throreetical Aspects [J].Jounray of Applied Polymer Science. 1993.48:639-656.
[3] 焦剑.蓝立文.潜伏性环氧树脂固化剂的发展[J].粘接.1997.(12):15~21.
[4] SHIGETOSHI T:IKECHI.HIDEAKI MATSUDA. Cross-linking of Bisepoxies with Divalent Metal Salts of p-Aminobenzoic Acid and Diamine [J]. Jounray of Applied Polymer Science.1993.48:1105-1114.
[5] Glibert M. D.Schneider N.S. Mechanism of the dicyan-diamide/Epoxy Reaction [J〕.Macromolecules.1996.24:360-369.
[6] 王正熙.红外光谱分析和鉴定.四川大学出版社.1989.
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