Ni-Cu-P化学镀工艺及组织结构的研究

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材料工程 ›› 2001, Vol. 0 ›› Issue (2) : 30-33.

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研究与应用

Ni-Cu-P化学镀工艺及组织结构的研究

于会生, 罗守福, 王永瑞

作者信息 +

The Technology and Microstructure of Electroless Ni-Cu-P Deposits

YU Hui-sheng, LUO Shou-fu, WANG Yong-rui

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文章历史 +

摘要

研究了Ni-Cu-P化学镀液主要成分、PH值、温度以及时间等工艺参数对化学沉积Ni-Cu-P合金镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数,得到了Cu含量从0到56.18wt%的Ni-Cu-P合金镀层。利用EDS和XRD研究了镀液中硫酸铜浓度对Ni-Cu-P合金镀层组织结构的影响。在硫酸铜浓度低于3g/L时,Ni-Cu-P合金镀层中P含量高于7.05wt%,合金镀层是非晶态结构。

Abstract

The effects of the deposition parameters such as bath composition, PH, temperature and time on the element contents and deposition rate of the electroless Ni-Cu-P deposits were studied. The electroless Ni-Cu-P deposits with various copper contents from 0 to 56.18 wt% were prepared through choosing the proper deposition parameters. The effect of copper sulfate concentration in the bathon the microstructure of the electroless Ni-Cu-P deposits was studied by using EDS and XRD. Ni-Cu-P deposits with phosphorus content more than 7.05wt% were amorphous, in the situation, the copper sulfate concentration in the bath was lower than 3g/L.

导出引用

于会生, 罗守福, 王永瑞. Ni-Cu-P化学镀工艺及组织结构的研究[J]. 材料工程, 2001, 0(2): 30-33

YU Hui-sheng, LUO Shou-fu, WANG Yong-rui. The Technology and Microstructure of Electroless Ni-Cu-P Deposits[J]. Journal of Materials Engineering, 2001, 0(2): 30-33

中图分类号： TQ153

参考文献

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