针对电子设备中器件在贮存环境下由于温度、湿度的变化引发的腐蚀问题,对引脚镀覆Ni/Pd/Au镀层的电子器件进行湿热试验,考察了贮存环境中的温度、相对湿度以及器件表面状态包括黏附盐分、表面划伤、黏附灰尘等因素对器件引脚表面镀层腐蚀的影响;用扫描电镜和能谱仪等研究了带Ni/Pd/Au镀层的电子器件在湿热环境下的腐蚀行为。结果表明:器件引脚表面存在三个腐蚀敏感区,分别是切边造成的基体暴露处、弯曲成形时形成的镀层裂纹处以及镀层表面的针孔处;温度和相对湿度对腐蚀有较大影响,当环境温度超过40℃,相对湿度超过80%后器件引脚镀层腐蚀加速;盐分和灰尘能够明显促进器件引脚镀层的腐蚀,有盐分和灰尘附着的表面,环境相对湿度在30%就能发生腐蚀。

In view of the corrosion problem of electronic devices in storage environment,electronic devices with Ni/Pd/Au coatings were investigated through humid temperature test.Simultaneously,the influence of temperature,relative humidity,and surface conditions including salts,additional lead scratches and dust on the corrosion of surface coating was evaluated.Scanning electron microscopy(SEM) and Energy dispersive spectroscopy(EDS) were used to study the corrosion behaviors of the electronic devices in hygrothermal environment.The results showed that there were three corrosion susceptible locations on the surface of component leads,namely exposed base metal from trimming,cracks due to forming,and porosity on the coating surface.Temperature and relative humidity(RH) greatly affected the corrosion of electronic device.Corrosion rate was accelerated when the temperature was higher than 40℃ and the relative humidity was higher than 80%.Salt and dust on the surface also have obviously accelerated impacts on the corrosion.Component surface with salt and dust could be eroded even at 30% relative humidity.