Diffusion Bonding of TiC Cermet/304SS with Ti/Nb/Cu Relief Interlayers

LI Jia, SHENG Guang-min

Journal of Materials Engineering ›› 2014, Vol. 0 ›› Issue (12) : 60-65.

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Journal of Materials Engineering ›› 2014, Vol. 0 ›› Issue (12) : 60-65. DOI: 10.11868/j.issn.1001-4381.2014.12.011

Diffusion Bonding of TiC Cermet/304SS with Ti/Nb/Cu Relief Interlayers

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 0(12): 60-65 https://doi.org/10.11868/j.issn.1001-4381.2014.12.011

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