Diffusion Bonding of TiC Cermet/304SS with Ti/Nb/Cu Relief Interlayers

LI Jia, SHENG Guang-min

Journal of Materials Engineering ›› 2014, Vol. 0 ›› Issue (12) : 60-65.

PDF(2250 KB)
  • Ei，ESCI收录期刊
  • 中国科学引文数据库(CSCD)核心期刊
  • 中文核心期刊
  • 文摘与引文数据库(Scopus)
  • 剑桥科学文摘(CSA)
PDF(2250 KB)
Journal of Materials Engineering ›› 2014, Vol. 0 ›› Issue (12) : 60-65. DOI: 10.11868/j.issn.1001-4381.2014.12.011

Diffusion Bonding of TiC Cermet/304SS with Ti/Nb/Cu Relief Interlayers

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 0(12): 60-65 https://doi.org/10.11868/j.issn.1001-4381.2014.12.011

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(2250 KB)

Accesses

Citation

Detail
Sections
Recommended

/

〈 〉