Hot Deformation Behavior of SiCP/A1-Cu Composite

Ming-yang CHENG, Shi-ming HAO, Jing-pei XIE, Ai-qin WANG, Dou-qin MA, Ya-li SUN

Journal of Materials Engineering ›› 2017, Vol. 45 ›› Issue (2) : 17-23.

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Journal of Materials Engineering ›› 2017, Vol. 45 ›› Issue (2) : 17-23. DOI: 10.11868/j.issn.1001-4381.2015.000528
RESEARCH ARTICLE

Hot Deformation Behavior of SiCP/A1-Cu Composite

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 45(2): 17-23 https://doi.org/10.11868/j.issn.1001-4381.2015.000528

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