Electrodeposition and Properties of Copper Layer on NdFeB Device

Yue LI, Li-qun ZHU, Wei-ping LI, Hui-cong LIU, Hai-yang NAN

Journal of Materials Engineering ›› 2017, Vol. 45 ›› Issue (6) : 55-60.

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Journal of Materials Engineering ›› 2017, Vol. 45 ›› Issue (6) : 55-60. DOI: 10.11868/j.issn.1001-4381.2015.001426
RESEARCH ARTICLE

Electrodeposition and Properties of Copper Layer on NdFeB Device

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 45(6): 55-60 https://doi.org/10.11868/j.issn.1001-4381.2015.001426

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