Molecular Dynamics Simulations of Deformation Behaviors for Nanocrystalline Cu/Ni Films Under Different Strain Rates

Cong CHENG, Shang-da CHEN, Yong-zhi WU, Hong-xiang HUANG

Journal of Materials Engineering ›› 2015, Vol. 43 ›› Issue (3) : 60-66.

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Journal of Materials Engineering ›› 2015, Vol. 43 ›› Issue (3) : 60-66. DOI: 10.11868/j.issn.1001-4381.2015.03.011

Molecular Dynamics Simulations of Deformation Behaviors for Nanocrystalline Cu/Ni Films Under Different Strain Rates

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 43(3): 60-66 https://doi.org/10.11868/j.issn.1001-4381.2015.03.011

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