Research on Microstructure and Properties of Sn-Sb-Cu-Ni Solder and Its Joints at Low Temperature

Hai-yan CHEN, Jian-bo CENG, Yu XIE, Mei-xiu LU, Yan NIU, Xia LI

Journal of Materials Engineering ›› 2015, Vol. 43 ›› Issue (11) : 57-64.

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Journal of Materials Engineering ›› 2015, Vol. 43 ›› Issue (11) : 57-64. DOI: 10.11868/j.issn.1001-4381.2015.11.010

Research on Microstructure and Properties of Sn-Sb-Cu-Ni Solder and Its Joints at Low Temperature

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 43(11): 57-64 https://doi.org/10.11868/j.issn.1001-4381.2015.11.010

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