Microstructural Evolution and Growth Morphology During Formation Process of Full Cu3Sn Solder Joint in Microelectronic Packaging

Xiao-bo LIANG, Xiao-yan LI, Peng YAO, Yang LI, Feng-yang JIN

Journal of Materials Engineering ›› 2018, Vol. 46 ›› Issue (8) : 106-112.

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Journal of Materials Engineering ›› 2018, Vol. 46 ›› Issue (8) : 106-112. DOI: 10.11868/j.issn.1001-4381.2017.000141
RESEARCH ARTICLE

Microstructural Evolution and Growth Morphology During Formation Process of Full Cu3Sn Solder Joint in Microelectronic Packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 46(8): 106-112 https://doi.org/10.11868/j.issn.1001-4381.2017.000141

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